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Wire Bonder
Molding
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Electronics Equipment Department

TOP > Camera Module Device

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Camera Module Device

Bonder

Die Bonder

Wide range of high performance Die Bonder available like;-
Silver epoxy die Bonding
Discrete application eutectic die bonding
LOC die bonding
Stack CSP application tape die bonding
Solder bonding

Wire Bonder

High speed gold wire bonder with smallest foot print.
Low gravity bonding head gives smooth and stable operation. Well designed touch panel assures oprator-friendly machine run.

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Strength Test

Bonding Tester

Applicable to test BGA, CSP, Gold/AL wire, bump and die shear.
Possible to test a bigger-sized sample wafer in a single setting.
Well developed data processing sotware line up available.
Pulling , shearing, and peeling test can be done in this single machine.

Lens

Lens gate cutting machine

This machine is for the automatic gate cut of plastic lens, and transfers cut lens to tray in line.

Lens Barrel Assembly

Lens assembling machine

This machine supports automatic transfer and assembly of lens, barrel, spacer and others.
And application of the UV adhesive, temporary hardening are supported.

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Reflow System

Reflow Oven

Ultra-small size and low power consumption lead-free reflow.
Stuitable for small substrate with high-mix low-volume production.
Minimum machine size is flexible to locate at production layout.

Cleaner

Fluorine system solvent washing machine

This cleaner makes simple and high quality cleaning.
Target particle to be removed is 1 micron level.

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Inspection

Camera module inspection system

This system supports for inspection of image level, phase, contrast, and for various image measurement functions. In addition, focus adjustment, visual image evaluation are also supported.

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Materials

Substrate

Please refer to the page of “Materials”.

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