Small size "Antistatic System for Ultrapure Water".
On high specific resistance ultra pure water process, this system prevents from particle re-dip for static.
The short cleaning time prevent your products from static damage.
Cleaning for dicing frame together with the wafer tape and NG chips at same timing.
Automatically starts from de-tape, cleaning and drying will enusre high performance for laborsaving & rationelization.
The machine sorts for Die/Package from wafer ring to after dicing.
and will select to pick up only non-defective die/package.
High-speed digital head able to achieve quick and low vibration direct pick-up.