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TOP > Assembly & Test Equipment Cleaning

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Assembly & Test Equipment  -Cleaning-

Dicing Frame Cleaning Machine

Cleaning for dicing frame together with the wafer tape and NG chips at same timing.
Automatically starts from de-tape, cleaning and drying will enusre high performance for laborsaving & rationalization.

BGA/CSP Cleaning Machine

This flux cleaning machine is adaptive for BGA, CSP, flip-chip etc.
Dip, shower and ultra sonic cleaning is available.
Carrying works vertically is for efficient soldering and saving cost.

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